Displacement Analysis of Dropping a Smartphone (DIC)

This is the analysis result of displacement with 3D DIC at smartphone dropping test using two sets of ACS-3 M16 mono. Point analysis at the location where strain gauges was paseted was common. But, 3D DIC can be useful to analyze the whole surface where was deformed at dropping in order to design good durable body.

Model: Two sets of ACS-3 M16 Mono / Frame rate: 10,000fps / Resolution: 1280 x 896 pixel

Contact nac for more information on the camera used to film this video.